Avyra Microsystems
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Platforms

Two core platforms for advanced electronics

Each platform has its own capability stack, technology, evidence base and customer outcomes. Shared engineering, AI and skills support sits behind both.

Multilayer HDI circuit boards on an automated production lineILLUSTRATION

HDI PCB and advanced printed electronics

High-density interconnect is the base of every intelligent system. This platform aims to build a local base for advanced boards that are often imported.

What it covers

  • HDI and multilayer design support
  • Fabrication and process control
  • Advanced printed electronics
  • Assembly and test
  • Qualification and reliability evidence

What you can ask for

  • HDI and multilayer PCB supply (through our commercial desk)
  • Prototype-to-volume ramp
  • Printed electronics modules
  • Technical and design services

How it will run: process control on each line, inspection at each stage, and digital traceability for each panel and lot.

What we aim for: shorter lead times, design-for-manufacture support and less reliance on a single source.

Semiconductor packaging and IC substrates

Advanced packaging is where device performance is won or lost. This platform covers substrates, assembly and the integration of different chips into one package.

What it covers

  • IC substrate fabrication
  • Advanced and heterogeneous packaging
  • Assembly, test and reliability
  • Thermal and signal integrity engineering
  • Cleanroom operations

What you can ask for

  • Substrate and package design support
  • Reliability testing and qualification support
  • Joint development with device makers
  • Substrate supply and packaging services (planned, from Phase II)

How it will run: controlled cleanroom conditions, yield analysis and recorded qualification gates.

What we aim for: access to advanced packaging capacity and a faster path from design to qualification.

Shared support

The support behind both platforms

Engineering and AI

AI-assisted design review, digital twins, simulation and yield analysis. People approve every result. See AI & Digital.

Research and skills

Applied research, technical standards work, and training for the people who run the lines. See Institution.

Laser-drilled microvias seen through a magnified cross-section of a PCBstacked microviasthrough viaILLUSTRATION

Where interconnect sits

Where our platforms sit in the value chain

  1. Chips
  2. Passive components
  3. HDI PCB and IC substrates
  4. Packaging and modules
  5. Intelligent systems

HDI boards and IC substrates are the layer that connects devices to systems. That is the layer we build.

HDI PCB roadmap

HDI PCB and printed electronics, phase by phase

PhaseYearsFocusStatus
I · Foundation1 to 3Multilayer and high-reliability boards, entry HDI, customer qualificationPlanned
II · Advanced HDI4 to 6Microvias, sequential lamination, laser direct imaging, fine linesPlanned
III · Next generation7 to 9Ultra HDI, substrate-like PCB, embedded passives, advanced thermalPlanned
IV · Printed intelligence10 and laterFlexible, stretchable and hybrid printed electronics, sensor integrationPlanned
Roadmap chevrons for phases I to IV of a platform (planned)IIIIIIIVphase by phase · plannedILLUSTRATION

Packaging roadmap

IC substrates and packaging, phase by phase

PhaseYearsFocusStatus
I · Foundation1 to 5Substrate engineering, package design support, reliability labsPlanned
II · Advanced packaging6 to 10Substrate production, flip-chip, wafer-level packagingPlanned
III · Integrated systems11 to 15Chiplets, heterogeneous packaging, 3D and optical integrationPlanned
IV · Next generation16 and laterPhotonic packaging, advanced system-in-packagePlanned

Substrate production starts in Phase II. Until then, the work is engineering, design support and reliability testing.

Eight platforms

Eight platforms in the wider plan, two are ours

The wider plan has eight platforms, from materials to research. AMS runs platform 2 (HDI PCB) and platform 3 (IC substrates and packaging). From the others we take only what HDI needs: qualified laminates and copper foil, the line tools, and HDI research and courses.

The other platforms are customers or suppliers to us, not our business. See Strategy for the chapter outline and Campus for where the lines will run.

Platform ring diagram: eight platforms around AMS, with platforms 2 and 3 highlighted12345678AMSeight platforms · ours: 2 and 3ILLUSTRATION

Markets

Markets our boards and substrates serve

  • Industrial automation
  • Telecommunications and data infrastructure
  • Automotive and mobility
  • Medical technology
  • Aerospace and defence
  • AI and high-performance computing

How we record a platform

Each platform keeps one record: what it is, its specifications, materials, capabilities, documents, qualification and history. Every value carries its unit, a verification state and an evidence reference. A value that is not yet verified is never shown as approved.

Value
Not connected
Unit
Not connected
Verification
Pending verification
Evidence
Not connected

Overview details for HDI PCB and advanced printed electronics appear here once approved by the accountable roles. Nothing on this page is a claim about a product.

How a record is approved

  1. Draft
  2. Submitted
  3. Technical review
  4. Approval
  5. Published

The person who prepares a record cannot approve it. Every change is kept in the history. Records service: Not connected

Next step

Match a platform to your requirement

Send us your technical scope. We will tell you which platform fits and what evidence we can provide.

Send a technical inquiry
Technician in cleanroom clothing handling a semiconductor substrateILLUSTRATION