AMS capabilities
Qualification and reliability evidence
Seven classes of evidence, six qualification outcomes, step controls from imaging to electrical test.
Open for inquiry
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Our products, built for the boards and packages inside modern electronics
Platforms, capabilities and programmes for HDI printed circuit boards and semiconductor packaging, each with its current stage shown plainly.
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Our platforms and capabilities
AMS platforms
Semiconductor packaging and IC substrate platform
IC substrate fabrication, advanced and heterogeneous packaging, assembly, test and reliability, thermal and signal integrity, cleanroom operations.
Planned
Ask about thisAMS programmes
First HDI campus line: eight project gates and seven readiness gates
Strategic approval, site, land, master plan, detailed engineering, construction, commissioning, commercial operations.
Planned
Ask about thisWhere it is used
Industries that use these offers
In the making
Work that is planned or being built. Nothing here is offered for sale yet.
Families
3 offers
AMS programmes
Strategic approval, site, land, master plan, detailed engineering, construction, commissioning, commercial operations.
See the family2 offers
AMS platforms
HDI and multilayer design support, fabrication and process control, printed electronics, assembly and test, qualification evidence.
See the family
Everything we offer
10 offers
AMS capabilities 5
- HDI design-for-manufacture supportDesign review against fabrication rules for HDI boardsOpen for inquiry
- Digital twin and process simulationLine and process digital twin for HDI and packaging; software and dataIn development
- Line analytics and yield insightYield and defect analytics on the HDI line dataIn development
- Qualification and reliability evidenceSeven classes of evidence, six qualification outcomes, step controls from imaging to electrical testOpen for inquiry
- Technical support and field serviceField service for HDI and semiconductor customersPlanned
AMS programmes 3
- First HDI campus line: eight project gates and seven readiness gatesStrategic approval, site, land, master plan, detailed engineering, construction, commissioning, commercial operationsPlanned
- IC substrate and packaging expansion (years 6 to 15)Substrates, flip-chip, wafer-level packaging, chiplets, heterogeneous and photonic packagingPlanned
- HDI and semiconductor academy and workforce developmentKnowledge capture, technical content, academy, workforce development and technical certification for the HDI linePlanned
AMS platforms 2
- HDI PCB and advanced printed electronics platformHDI and multilayer design support, fabrication and process control, printed electronics, assembly and test, qualification evidencePlanned
- Semiconductor packaging and IC substrate platformIC substrate fabrication, advanced and heterogeneous packaging, assembly, test and reliability, thermal and signal integrity, cleanroom operationsPlanned
Names here are general descriptions. Makers, prices and delivery terms are shared in your members area after an enquiry. "Planned" and "in development" items are not yet offered for sale. This list is a map of what we can arrange, often with qualified partners. It does not confirm that every item is licensed, certified or in stock: we confirm that for your request, in writing, before any order.
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Tap one petal, the centre of a honeycomb for the whole group, a petal from each honeycomb, or any mix. 2 sectors today, growing to 50. Under your choice you will see what is on offer in seven fixed categories: Hardware, Software, Cloud, Data, Analytics, Others and Services.
Large technology sectors Investment, enterprise, development and management
Nothing chosen yet. Showing the shared core, the same in every sector.